{"version":"1.0","provider_name":"Institute for Applied Microelectronics","provider_url":"https:\/\/www.iuma.ulpgc.es\/en","author_name":"wordpress","author_url":"https:\/\/www.iuma.ulpgc.es\/en\/author\/wordpress-2\/","title":"Divisi\u00f3n de Dise\u00f1o de Sistemas Integrados - Proyectos - Instituto Universitario de Microelectr\u00f3nica Aplicada","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"Z71DfAZBcO\"><a href=\"https:\/\/www.iuma.ulpgc.es\/en\/dsi-proyectos\/\">Divisi\u00f3n de Dise\u00f1o de Sistemas Integrados &#8211; Proyectos<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.iuma.ulpgc.es\/en\/dsi-proyectos\/embed\/#?secret=Z71DfAZBcO\" width=\"600\" height=\"338\" title=\"&#8220;Divisi\u00f3n de Dise\u00f1o de Sistemas Integrados &#8211; Proyectos&#8221; &#8212; Instituto Universitario de Microelectr\u00f3nica Aplicada\" data-secret=\"Z71DfAZBcO\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/www.iuma.ulpgc.es\/wp-includes\/js\/wp-embed.min.js\n\/* ]]> *\/\n<\/script>","thumbnail_url":"https:\/\/www.iuma.ulpgc.es\/wp-content\/uploads\/2024\/02\/Noticias-1-new.jpg","thumbnail_width":1038,"thumbnail_height":1038,"description":"Presentaci\u00f3n Miembros Investigaci\u00f3n Proyectos Proyectos y convenios Proyecto GigaStream Desarrollo de un elemento de conmutaci\u00f3n CSX de alta velocidad con un ancho de banda agregado de hata 80 Gbps. Este proyecto, desarrollado para Vitesse Semiconductors Corp. (California) en colaboraci\u00f3n con empresas de EE.UU, Reino Unido e India esta formado por un chipset que incluye una [&hellip;]"}